Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
The continued downscaling of semiconductor fabrication has imposed increasingly tighter overlay tolerances. Such tight tolerances will require very high performance in alignment. Hence, the objective of this research to establish characterization process for alignment evaluation and to determine th...
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| 格式: | Thesis |
| 语言: | English |
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| 在线阅读: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/63456/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/63456/2/Full%20text.pdf |
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