Effect of different process parameters on the heat transfer of liquid coolant in electronic system

An effective heat transfer system is important for new technologies today to enhance the performance of heat transfer, especially, since the miniaturization of electronic system that resulted in dramatic increase in the amount of heat generated. In the case, where air cooling could not meet requirem...

Full description

Saved in:

Bibliographic Details
Format:	Thesis
Language:	English
Subjects:	Cooling systems Heat > Transmission Heat sinks (Electronics) Heat transfer Liquid coolant
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/4/Wan%20Mohd%20Arif.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-unimap-72601
record_format	uketd_dc
spelling	my-unimap-726012023-03-06T00:52:46Z Effect of different process parameters on the heat transfer of liquid coolant in electronic system Yeoh, Cheow Keat, Dr. An effective heat transfer system is important for new technologies today to enhance the performance of heat transfer, especially, since the miniaturization of electronic system that resulted in dramatic increase in the amount of heat generated. In the case, where air cooling could not meet requirements, liquid cooling does offer significant cooling advantages over conventional air cooling because of its better thermal transfer property. But unsuitable selection of liquid coolants may result to low performance or problems to the cooling systems. This study investigates the effect of different process parameters on the heat transfer of the liquid cooling. Experimental investigations have been carried out for determining the cooling performance of distilled water, vegetable oil and alumina sols in cooling system of central processing units (CPU) at different parameters of input power and mass flow rate. Optimising the pH values is very crucial because it will determine the stability of alumina sols, an optimal pH value of pH 4 is obtained for the alumina sols. There is no significant effect to the viscosity of the alumina sols because of low concentrations of alumina particles are dispersed in base fluids. Input power is direct influence to the final temperatures of CPU block and fluids. The heat transfer coefficient of the fluids is improved and a clear decrease of the junction temperature between the heated component and the water cooling block due to the higher mass flow rate. Alumina sols show better heat removal capability and higher heat transfer coefficient than distilled water and vegetable oil due to the presence of alumina particles in the fluids. Experimental results emphasize the higher molarity of alumina sols contributes higher heat transfer coefficient. The heat removal capability of 0.1 M, 0.5 M and 1.0 M alumina sols have been found as much as 15.4 %, 32.3 % and 40.8 % higher than distilled water. This study recommend that a stable 1.0M alumina sol may be use as liquid coolant for CPU cooling system as well as in component test handlers in semiconductor industry. Universiti Malaysia Perlis (UniMAP) Thesis en http://dspace.unimap.edu.my:80/xmlui/handle/123456789/72601 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/1/Page%201-24.pdf 9219aba652d973ae5e3e381e898dc3ab http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/2/Full%20text.pdf cec7b9778a0e64e4bb87247e86575e64 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/4/Wan%20Mohd%20Arif.pdf 839eb1ebcecccae9e7fab9c1216c00a6 Universiti Malaysia Perlis (UniMAP) Cooling systems Heat -- Transmission Heat sinks (Electronics) Heat transfer Liquid coolant School of Materials Engineering
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
advisor	Yeoh, Cheow Keat, Dr.
topic	Cooling systems Heat -- Transmission Heat sinks (Electronics) Heat transfer Liquid coolant
spellingShingle	Cooling systems Heat -- Transmission Heat sinks (Electronics) Heat transfer Liquid coolant Effect of different process parameters on the heat transfer of liquid coolant in electronic system
description	An effective heat transfer system is important for new technologies today to enhance the performance of heat transfer, especially, since the miniaturization of electronic system that resulted in dramatic increase in the amount of heat generated. In the case, where air cooling could not meet requirements, liquid cooling does offer significant cooling advantages over conventional air cooling because of its better thermal transfer property. But unsuitable selection of liquid coolants may result to low performance or problems to the cooling systems. This study investigates the effect of different process parameters on the heat transfer of the liquid cooling. Experimental investigations have been carried out for determining the cooling performance of distilled water, vegetable oil and alumina sols in cooling system of central processing units (CPU) at different parameters of input power and mass flow rate. Optimising the pH values is very crucial because it will determine the stability of alumina sols, an optimal pH value of pH 4 is obtained for the alumina sols. There is no significant effect to the viscosity of the alumina sols because of low concentrations of alumina particles are dispersed in base fluids. Input power is direct influence to the final temperatures of CPU block and fluids. The heat transfer coefficient of the fluids is improved and a clear decrease of the junction temperature between the heated component and the water cooling block due to the higher mass flow rate. Alumina sols show better heat removal capability and higher heat transfer coefficient than distilled water and vegetable oil due to the presence of alumina particles in the fluids. Experimental results emphasize the higher molarity of alumina sols contributes higher heat transfer coefficient. The heat removal capability of 0.1 M, 0.5 M and 1.0 M alumina sols have been found as much as 15.4 %, 32.3 % and 40.8 % higher than distilled water. This study recommend that a stable 1.0M alumina sol may be use as liquid coolant for CPU cooling system as well as in component test handlers in semiconductor industry.
format	Thesis
title	Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_short	Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_full	Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_fullStr	Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_full_unstemmed	Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_sort	effect of different process parameters on the heat transfer of liquid coolant in electronic system
granting_institution	Universiti Malaysia Perlis (UniMAP)
granting_department	School of Materials Engineering
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/72601/4/Wan%20Mohd%20Arif.pdf
_version_	1776104223946047488

Effect of different process parameters on the heat transfer of liquid coolant in electronic system

Similar Items