Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
The revolution of electronic applications which have been assembled in smaller parts, lighter and more functional, causes the solder to become crucial over the worlds. These classes of low melting point alloys must provide a unique set properties to ensure the reliability of the electronic assemblie...
Saved in:
| 格式: | Thesis |
|---|---|
| 语言: | English |
| 主题: | |
| 在线阅读: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77087/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77087/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77087/4/Sayyidah.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|
成为第一个发表评论!