The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to de...
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| Format: | Thesis |
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| Language: | English |
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/4/Mohd%20Izrul%20Izwan.pdf |
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| Summary: | For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to develop a new generation of interconnect materials that is equipped with a combination of good mechanical, electrical and thermal properties that fulfil the requirement of electronic industry. In this project, a new
generation of lead-free (Sn-Cu-Ni) solder alloy was developed to form a composite solder. Five new lead-free composite solders were successfully synthesized using the
powder metallurgy method, which consists of mixing, compaction, and sintering
process. This research also assisted by a hybrid microwave assisted sintering process,
which showed significant advantages in processing compared to conventional sintering
method, such as rapid heating rate, shortened sintering time, less energy consumption
and less expensive equipment. Five non-metallic reinforcements (Silicon Nitride,
Titanium Oxide, Silicon Carbide, Silicon, and Activated Carbon) with various
percentages (0, 0.25, 0.5, 0.75, and 1.0 wt. %) were intentionally incorporated into the
solder matrix. The microstructure, electrical, thermal, physical properties, and
mechanical properties of the composite solders were investigated. Addition of
reinforcement particle into a Sn-Cu-Ni solder matrix has led to improvement in thermal
performance and mechanical performance. The result also has shown there are no
change in the melting temperature and electrical performance. The presence of
reinforcement’s particles was effective in retarding the interfacial intermetallic layer
formation. The shear strength of composite solder were improved with addition of
reinforcement particles. All of composite solder system also showed better wettability
which improvement in contact angle on Cu-substrate compare with monolithic solder.
XRD result showed that there are no new reaction phases occur in the new composite
system. Overall, the Sn-Cu-Ni composite solder showed an improvement compared to
the monolithic solder and the Sn-Cu-Ni+AC were the most preferable composite solder.
Its excellent mechanical properties make the Sn-Cu-Ni+AC composite solder an
alternative and ideal choice to replace current lead free solder in the electronic industry |
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