Hot air solder levelling (HASL) process parameters optimization for SN100CL
Reliability of electronic packaging has now become the most critical factor in electronic industries. The prediction of solder joint failure and its shelf life becomes more challenging as the increasing demand for superior performance of electronic devices. In electronic packaging, surface finish p...
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| Format: | Thesis |
|---|---|
| Language: | English |
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/4/Fatin%20Afeeqa.pdf |
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