Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor.
Chicago Style (17th ed.) CitationThermal-mechanical Analysis of Bonding Pad in Insulated Gate Bipolar Transistor.
MLA引文Thermal-mechanical Analysis of Bonding Pad in Insulated Gate Bipolar Transistor.
警告：這些引文格式不一定是100％准確.