Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
The usage of composite solder is one of the method in improving stability of the solder joints. Addition of certain particles such SiC to form a composite solder has been given greater attention since it can enhance the mechanical properties of solder and has been proven by other researchers. Thi...
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التنسيق: | أطروحة |
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اللغة: | English |
الموضوعات: | |
الوصول للمادة أونلاين: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/3/Declaration%20Form.pdf |
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مواد مشابهة
- Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
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Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
بواسطة: Muhammad Hafiz, Zan @ Hazizi - Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
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Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
بواسطة: Dharma, I Gusti Bagus Budi - The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement