Numerical simulations of innovative ground plane and double-gate configurations in thin-body and -buried oxide of SOI MOSFETS

The downscaling of transistors enables an increased in transistor density, faster switching speeds and greater complexity with no increase in power consumption. However, the scaling of the conventional planar MOS transistors appears to be reaching the end of the technology roadmap due to worsening...

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Format: Thesis
Language:English
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Online Access:http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77998/1/Page%201-24.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77998/2/Full%20text.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77998/4/Noraini%20Othman.pdf
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Summary:The downscaling of transistors enables an increased in transistor density, faster switching speeds and greater complexity with no increase in power consumption. However, the scaling of the conventional planar MOS transistors appears to be reaching the end of the technology roadmap due to worsening performance variability and shortchannel effects (SCEs). One of the contenders anticipated to replace the current transistor architecture is planar ultra-thin body and BOX (UTBB) SOI MOSFET. The advantage of the thin-body SOI structure lies in its simple planar process which is fully compatible with the bulk silicon CMOS flow. In this research work, a particular attention is being given to the performance of UTBB SOI MOSFETs with its thin BOX in improving electrostatics behaviour namely of drain-induced barrier lowering (DIBL) of the thin-body as compared to thick BOX (UTB) SOI transistors for extending CMOS scalability. Subsequently, UTBB with different ground plane (GP) architectures and gate configurations (i.e. single-gate (SG) vs double-gate (DG)) are extensively studied through numerical simulations as possible candidates for the continuation of Moore‟s Law. In-depth study of the digital and analog/RF figure-of-merit (FoM) are carried out in a wide range of frequency (from 0.01 Hz to 100 GHz) in correlation with device operation mechanisms. It is discovered that an innovative GP formation made of localized GP of p-type in the substrate underneath the channel (referred herein throughout the thesis as GP-B) effectively suppress substrate depletion effects and shows better immunity against SCEs from the digital analysis viewpoint. Further improvements in the immunity against SCEs can be achieved in DG configurations where the impact of different GP architectures is amplified as compared to SG. Even though the use of DG configurations provides superior digital performance, lower current gain cut-off frequency (ft) values are produced than SG in the analog domain due to an increase of gate-to-gate capacitances (Cgg). Therefore, careful selections and trade-offs are needed when selecting a particular device structure where the results obtained in this research work contribute to the identifications of GP architectures and gate configurations (SG or DG) that can be adopted in device design to suit specific applications of either digital or RF.