APA引文

Muhammad Nubli, Z. Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA).

Chicago Style (17th ed.) Citation

Muhammad Nubli, Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA).

MLA引文

Muhammad Nubli, Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA).

警告：这些引文格式不一定是100％准确.