Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis

X-FAB uses patented process technology to produce analog/mixed-signal ICs. As a pure-play foundry, X-FAB does not produce its own integrated circuits (ICs), instead manufacturing them using designs produced by its clients or other parties in collaboration, mostly using X-FAB's portfolio of modu...

Full description

Saved in:

Bibliographic Details
Main Author:	Handie, Ahmataku
Format:	Thesis
Language:	English English English
Published:	2024
Subjects:	TJ Mechanical engineering and machinery TP Chemical technology
Online Access:	http://ir.unimas.my/id/eprint/44443/5/Thesis%20master_%20Handie%20Ahmataku%20-%2024%20pages.pdf http://ir.unimas.my/id/eprint/44443/6/Thesis%20master_%20Handie%20Ahmataku.ftext.pdf http://ir.unimas.my/id/eprint/44443/7/DSVA_Handie%20Ahmataku.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-unimas-ir.44443
record_format	uketd_dc
spelling	my-unimas-ir.444432024-05-14T08:00:46Z Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis 2024-04 Handie, Ahmataku TJ Mechanical engineering and machinery TP Chemical technology X-FAB uses patented process technology to produce analog/mixed-signal ICs. As a pure-play foundry, X-FAB does not produce its own integrated circuits (ICs), instead manufacturing them using designs produced by its clients or other parties in collaboration, mostly using X-FAB's portfolio of modular, highly specialized proprietary process technologies and intellectual property (IP). Chemical Mechanical Polishing (CMP) cross-sectioning technique has been recognized for many years as failure analysis fundamental tool for examining depth-related profile of a sample. Therefore, it is a precious tool in semiconductor industry as its exclusive characteristic of providing entry into a third dimension in a two-dimension world. Process levels can be micro sectioned and capability to inspect layer-by-layer made this method crucial in gathering information on fabrication parameters and on defects. Another advantage of CMP cross-sectioning is its wide area of observation as compared to other cross-sectioning methods such as Focus Ion Beam (FIB). CMP cross-sectioning requires high skilled failure analyst and require couple of hours to complete a section of reasonable complexity of target. Typically, CMP cross-sectioning is performed in three basic steps: physical mounting, coarse grind and final polish. These three steps are time consuming particularly during coarse grind, the analyst need to realign the target before it reaches to final polish. Any technology that can reduce the polishing turnaround time is most welcomed on this day. Allied High-Tech Products. Inc. is a well-known maker of precision grinders and polishers. This research will provide a new idea of design and fabrication of the anticipated polisher fixture called Rapid Alignment Polisher Stage (RAPH), which will assist a fast, controllable, and accurate target alignment which current method is lacked off. This product is believed able to decrease the polishing turnaround time significantly. Universiti Malaysia Sarawak 2024-04 Thesis http://ir.unimas.my/id/eprint/44443/ http://ir.unimas.my/id/eprint/44443/5/Thesis%20master_%20Handie%20Ahmataku%20-%2024%20pages.pdf text en public http://ir.unimas.my/id/eprint/44443/6/Thesis%20master_%20Handie%20Ahmataku.ftext.pdf text en validuser http://ir.unimas.my/id/eprint/44443/7/DSVA_Handie%20Ahmataku.pdf text en staffonly masters Universiti Malaysia Sarawak Faculty of Engineering
institution	Universiti Malaysia Sarawak
collection	UNIMAS Institutional Repository
language	English English English
topic	TJ Mechanical engineering and machinery TP Chemical technology
spellingShingle	TJ Mechanical engineering and machinery TP Chemical technology Handie, Ahmataku Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis
description	X-FAB uses patented process technology to produce analog/mixed-signal ICs. As a pure-play foundry, X-FAB does not produce its own integrated circuits (ICs), instead manufacturing them using designs produced by its clients or other parties in collaboration, mostly using X-FAB's portfolio of modular, highly specialized proprietary process technologies and intellectual property (IP). Chemical Mechanical Polishing (CMP) cross-sectioning technique has been recognized for many years as failure analysis fundamental tool for examining depth-related profile of a sample. Therefore, it is a precious tool in semiconductor industry as its exclusive characteristic of providing entry into a third dimension in a two-dimension world. Process levels can be micro sectioned and capability to inspect layer-by-layer made this method crucial in gathering information on fabrication parameters and on defects. Another advantage of CMP cross-sectioning is its wide area of observation as compared to other cross-sectioning methods such as Focus Ion Beam (FIB). CMP cross-sectioning requires high skilled failure analyst and require couple of hours to complete a section of reasonable complexity of target. Typically, CMP cross-sectioning is performed in three basic steps: physical mounting, coarse grind and final polish. These three steps are time consuming particularly during coarse grind, the analyst need to realign the target before it reaches to final polish. Any technology that can reduce the polishing turnaround time is most welcomed on this day. Allied High-Tech Products. Inc. is a well-known maker of precision grinders and polishers. This research will provide a new idea of design and fabrication of the anticipated polisher fixture called Rapid Alignment Polisher Stage (RAPH), which will assist a fast, controllable, and accurate target alignment which current method is lacked off. This product is believed able to decrease the polishing turnaround time significantly.
format	Thesis
qualification_level	Master's degree
author	Handie, Ahmataku
author_facet	Handie, Ahmataku
author_sort	Handie, Ahmataku
title	Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis
title_short	Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis
title_full	Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis
title_fullStr	Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis
title_full_unstemmed	Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis
title_sort	development of rapid alignment polisher’s hand (raph) for cross section polishing in physical failure analysis
granting_institution	Universiti Malaysia Sarawak
granting_department	Faculty of Engineering
publishDate	2024
url	http://ir.unimas.my/id/eprint/44443/5/Thesis%20master_%20Handie%20Ahmataku%20-%2024%20pages.pdf http://ir.unimas.my/id/eprint/44443/6/Thesis%20master_%20Handie%20Ahmataku.ftext.pdf http://ir.unimas.my/id/eprint/44443/7/DSVA_Handie%20Ahmataku.pdf
_version_	1804888428777570304

Development of Rapid Alignment Polisher’s Hand (RAPH) for Cross section Polishing in Physical Failure Analysis

Similar Items