The Development of a No-Clean Solder for Radio Frequency Power Module

The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine n...

Full description

Saved in:

Bibliographic Details
Main Author:	Sns Bukhari, Mohabattul Zaman
Format:	Thesis
Language:	English English
Published:	1997
Subjects:	Universiti Putra Malaysia - Dissertations Solder and soldering - Case studies Radio frequency modulation - Case studies
Online Access:	http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-upm-ir.10021
record_format	uketd_dc
spelling	my-upm-ir.100212011-03-01T08:37:57Z The Development of a No-Clean Solder for Radio Frequency Power Module 1997-01 Sns Bukhari, Mohabattul Zaman The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine no-clean solder paste candidates ranging from different solder paste suppliers which are Heraeus, Indalloy, Multicore, Qualitek, Asahi Solders, Demetron, Koki, SCM and Alphametals were selected. Five solder preliminary tests which are flux weight loss, wetting, slump, solder balling, flux spread and four solder printing characteristics which are paste rolling solder coverage, solder fillet and joint texture were used as a tool to select the best no-clean solder that meet the product requirements. Heraeus and Indalloy no-clean solder pastes showed better results compared to others but still required some process changes. Two methods were used in order to eliminate the solder defects which are the development of the new stencil and new soldering reflow profile. These methods able to resolve the solder defects problem such as flux overflow, solder cold joint, solder splashing and solder balling formation. The selected no-clean solder paste together with the normal production solder paste known as control solder paste were further subjected to the paste level evaluations and the reliability tests. It was found that the Heraeus and Indalloy no-clean solder paste are the best candidates for noclean solder process capability. The results of these tests are presented and discussed in this thesis. Universiti Putra Malaysia - Dissertations Solder and soldering - Case studies Radio frequency modulation - Case studies 1997-01 Thesis http://psasir.upm.edu.my/id/eprint/10021/ http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf application/pdf en public masters Universiti Putra Malaysia Universiti Putra Malaysia - Dissertations Solder and soldering - Case studies Radio frequency modulation - Case studies Faculty of Engineering English
institution	Universiti Putra Malaysia
collection	PSAS Institutional Repository
language	English English
topic	Universiti Putra Malaysia - Dissertations Solder and soldering - Case studies Radio frequency modulation - Case studies
spellingShingle	Universiti Putra Malaysia - Dissertations Solder and soldering - Case studies Radio frequency modulation - Case studies Sns Bukhari, Mohabattul Zaman The Development of a No-Clean Solder for Radio Frequency Power Module
description	The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine no-clean solder paste candidates ranging from different solder paste suppliers which are Heraeus, Indalloy, Multicore, Qualitek, Asahi Solders, Demetron, Koki, SCM and Alphametals were selected. Five solder preliminary tests which are flux weight loss, wetting, slump, solder balling, flux spread and four solder printing characteristics which are paste rolling solder coverage, solder fillet and joint texture were used as a tool to select the best no-clean solder that meet the product requirements. Heraeus and Indalloy no-clean solder pastes showed better results compared to others but still required some process changes. Two methods were used in order to eliminate the solder defects which are the development of the new stencil and new soldering reflow profile. These methods able to resolve the solder defects problem such as flux overflow, solder cold joint, solder splashing and solder balling formation. The selected no-clean solder paste together with the normal production solder paste known as control solder paste were further subjected to the paste level evaluations and the reliability tests. It was found that the Heraeus and Indalloy no-clean solder paste are the best candidates for noclean solder process capability. The results of these tests are presented and discussed in this thesis.
format	Thesis
qualification_level	Master's degree
author	Sns Bukhari, Mohabattul Zaman
author_facet	Sns Bukhari, Mohabattul Zaman
author_sort	Sns Bukhari, Mohabattul Zaman
title	The Development of a No-Clean Solder for Radio Frequency Power Module
title_short	The Development of a No-Clean Solder for Radio Frequency Power Module
title_full	The Development of a No-Clean Solder for Radio Frequency Power Module
title_fullStr	The Development of a No-Clean Solder for Radio Frequency Power Module
title_full_unstemmed	The Development of a No-Clean Solder for Radio Frequency Power Module
title_sort	development of a no-clean solder for radio frequency power module
granting_institution	Universiti Putra Malaysia
granting_department	Faculty of Engineering
publishDate	1997
url	http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf
_version_	1747811021649608704

The Development of a No-Clean Solder for Radio Frequency Power Module

Similar Items