Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
In welding and metallurgical processes, solder is used to join two or more metallic surfaces. Today, the use of solder in modern microelectronic technology is ubiquitous. Lead solder has been widely used in the semiconductor industry for a long time. In soldering process, demands for elevated temper...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2014
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| Online Access: | http://psasir.upm.edu.my/id/eprint/52060/1/FK%202014%20104RR.pdf |
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