Solving crack problems in bonded dissimilar materials using hypersingular integral equations
Inclined or circular arc cracks problems and thermally insulated inclined or circular arc cracks problems subjected to remote stress in bonded dissimilar materials are formulated. The modified complex variable function method with the continuity conditions of the resultant force and displacement...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2019
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| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/90880/1/IPM%202020%205%20-%20IR.pdf |
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| Summary: | Inclined or circular arc cracks problems and thermally insulated inclined or circular
arc cracks problems subjected to remote stress in bonded dissimilar materials
are formulated. The modified complex variable function method with the continuity
conditions of the resultant force and displacement function are used to formulate the
hypersingular integral equations (HSIEs) for these problems. Whereas, the continuity
condition of heat conduction function is utilized to formulate the HSIEs for
the thermally insulated cracks problems. The unknown crack opening displacement
(COD) function is mapped into the square root singularity function using the curved
length coordinate method. Then the appropriate quadrature formulas are used to
solve the obtained equations numerically, with the traction along the crack as the
right hand term. The obtained COD function is then used to compute the stress intensity
factors (SIF) in order to determine the stability behavior of bodies or materials
containing cracks or flaws. Numerical results of the nondimensional SIF at all the
cracks tips are presented. Our results are totally in good agreements with those of the
previous works. It is observed that the nondimensional SIF at the cracks tips depend
on the remote stress, the elastic constants ratio, the crack geometries, the distance
between each cracks and the distance between the crack and the boundary. Whereas
for thermally insulated cracks, the nondimensional SIF at the cracks tips depend on
the heat conductivity ratio and the thermal expansion coefficients ratio. |
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