Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) tela...
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2015
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my-usm-ep.303672019-04-12T05:25:50Z Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications 2015-01 Tan , Kim Seah TN1-997 Mining engineering. Metallurgy Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal. A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure. 2015-01 Thesis http://eprints.usm.my/30367/ http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral |
| institution |
Universiti Sains Malaysia |
| collection |
USM Institutional Repository |
| language |
English |
| topic |
TN1-997 Mining engineering Metallurgy |
| spellingShingle |
TN1-997 Mining engineering Metallurgy Tan , Kim Seah Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications |
| description |
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan
mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin,
terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan
lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah
ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka
pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan
terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal.
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu
nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol)
which is meant for high-temperature die-attach applications has been developed.
Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the
Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30
min without the need of applied external pressure. |
| format |
Thesis |
| qualification_name |
Doctor of Philosophy (PhD.) |
| qualification_level |
Doctorate |
| author |
Tan , Kim Seah |
| author_facet |
Tan , Kim Seah |
| author_sort |
Tan , Kim Seah |
| title |
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_short |
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_full |
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_fullStr |
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_full_unstemmed |
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications |
| title_sort |
investigations on silver-copper
nanopaste as die-attach material for
high temperature applications |
| granting_institution |
Universiti Sains Malaysia |
| granting_department |
Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral |
| publishDate |
2015 |
| url |
http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf |
| _version_ |
1747820321340129280 |