Solder Joint Reliability Of Flip Chip BGA Package

Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.

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Bibliographic Details
Main Author:	Lee, Kor Oon
Format:	Thesis
Language:	English
Published:	2004
Subjects:	TA1-2040 Engineering (General) Civil engineering (General)
Online Access:	http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf
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id	my-usm-ep.3572
record_format	uketd_dc
spelling	my-usm-ep.35722017-04-17T09:26:38Z Solder Joint Reliability Of Flip Chip BGA Package 2004-03 Lee, Kor Oon TA1-2040 Engineering (General). Civil engineering (General) Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages. 2004-03 Thesis http://eprints.usm.my/3572/ http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TA1-2040 Engineering (General) Civil engineering (General)
spellingShingle	TA1-2040 Engineering (General) Civil engineering (General) Lee, Kor Oon Solder Joint Reliability Of Flip Chip BGA Package
description	Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.
format	Thesis
qualification_level	Master's degree
author	Lee, Kor Oon
author_facet	Lee, Kor Oon
author_sort	Lee, Kor Oon
title	Solder Joint Reliability Of Flip Chip BGA Package
title_short	Solder Joint Reliability Of Flip Chip BGA Package
title_full	Solder Joint Reliability Of Flip Chip BGA Package
title_fullStr	Solder Joint Reliability Of Flip Chip BGA Package
title_full_unstemmed	Solder Joint Reliability Of Flip Chip BGA Package
title_sort	solder joint reliability of flip chip bga package
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Mekanikal
publishDate	2004
url	http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf
_version_	1747819667192283136

Solder Joint Reliability Of Flip Chip BGA Package

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