Solder Joint Reliability Of Flip Chip BGA Package
Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2004
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| Online Access: | http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf |
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