Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging
The demand for mobile and tablet devices is at all time high for the last decade, overwhelming attention has been paid to this field, the novelty studies that needed in industry to accompany this demand is to characterize the steady state and transient studies for satisfactory thermal performance on...
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Main Author: | Ong, Kean Aik |
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Format: | Thesis |
Language: | English |
Published: |
2017
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Subjects: | |
Online Access: | http://eprints.usm.my/36421/1/Pages_from_ONG_KEAN_AIK_MFAR_24_PAGES.pdf |
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