Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow

Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from...

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Main Author:	Loo , Kean Ann
Format:	Thesis
Language:	English
Published:	2017
Subjects:	TK Electrical Engineering Electronics Nuclear Engineering
Online Access:	http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf
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id	my-usm-ep.39584
record_format	uketd_dc
spelling	my-usm-ep.395842019-04-12T05:25:07Z Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow 2017 Loo , Kean Ann TK Electrical Engineering. Electronics. Nuclear Engineering TK1-9971 Electrical engineering. Electronics. Nuclear engineering Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from solder bump fraction result from deficient packaging process. Today semiconductor manufacturing test flow is still imperfect to completely screen or detect the SBB defect. As bounce back, the test holes contributes to the defect per million (DPM) of the product. In this research, the test holes of SBB defect in High Volume Manufacturing (HVM) will be defined. Meanwhile, SBB defect characterization will be studied where the electrical behavioural of baby bumps is explained. In the final part of the study, an effective SBB screening test at Burn In is developed to minimizing test holes. From the research finding, un-bridging of SBB occurs at extreme high current of 4.5 A where the baby bump burnt and partial unbridged. This unbridged state are unstable and lacking in term of reliability. However, the SBB un-bridging only impacted on Type B SBB defect where baby bump bridging power bump with ground bump. Lastly, the SBB screening test at Burn In stage is developed as part of this research. In conclusion, the proposed test has the potential in minimizing HVM SBB defect test holes by improving SBB defect fault coverage. 2017 Thesis http://eprints.usm.my/39584/ http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Elektrik dan Elektronik
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TK Electrical Engineering Electronics Nuclear Engineering TK Electrical Engineering Electronics Nuclear Engineering
spellingShingle	TK Electrical Engineering Electronics Nuclear Engineering TK Electrical Engineering Electronics Nuclear Engineering Loo , Kean Ann Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
description	Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from solder bump fraction result from deficient packaging process. Today semiconductor manufacturing test flow is still imperfect to completely screen or detect the SBB defect. As bounce back, the test holes contributes to the defect per million (DPM) of the product. In this research, the test holes of SBB defect in High Volume Manufacturing (HVM) will be defined. Meanwhile, SBB defect characterization will be studied where the electrical behavioural of baby bumps is explained. In the final part of the study, an effective SBB screening test at Burn In is developed to minimizing test holes. From the research finding, un-bridging of SBB occurs at extreme high current of 4.5 A where the baby bump burnt and partial unbridged. This unbridged state are unstable and lacking in term of reliability. However, the SBB un-bridging only impacted on Type B SBB defect where baby bump bridging power bump with ground bump. Lastly, the SBB screening test at Burn In stage is developed as part of this research. In conclusion, the proposed test has the potential in minimizing HVM SBB defect test holes by improving SBB defect fault coverage.
format	Thesis
qualification_level	Master's degree
author	Loo , Kean Ann
author_facet	Loo , Kean Ann
author_sort	Loo , Kean Ann
title	Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_short	Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_full	Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_fullStr	Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_full_unstemmed	Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_sort	microprocessor solder bump bridging defects screening strategy in manufacturing test flow
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Elektrik dan Elektronik
publishDate	2017
url	http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf
_version_	1747820761588957184

Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow

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