APA引文

Tan , A. H. (2015). Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging.

Chicago Style (17th ed.) Citation

Tan , Ai Heong. Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging. 2015.

MLA引文

Tan , Ai Heong. Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging. 2015.

警告：这些引文格式不一定是100％准确.