Aziz, M. S. A. (2015). Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board.
Chicago Style (17th ed.) CitationAziz, Mohd Sharizal Abdul. Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board. 2015.
MLA引文Aziz, Mohd Sharizal Abdul. Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board. 2015.
警告:这些引文格式不一定是100%准确.