20-Gbps High-Speed Converged I/O Loop Back Test Design Methodology For Signal Integrity Enhancement
In high-volume manufacturing (HVM), the degradations of signals at high speed and high frequencies will affect test results. In the semiconductor field, inaccuracies of test setup impact a product yield, increase test operating cost and delay products release time. With the demand for rapid improve...
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| 主要作者: | |
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| 格式: | Thesis |
| 語言: | English |
| 出版: |
2015
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| 主題: | |
| 在線閱讀: | http://eprints.usm.my/41327/1/RAGUBALAN_AL_SHANMUGAM_24_Pages.pdf |
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