Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...

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Main Author:	Ang , Karen Huei Ling
Format:	Thesis
Language:	English
Published:	2011
Subjects:	TN1-997 Mining engineering Metallurgy
Online Access:	http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf
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id	my-usm-ep.41879
record_format	uketd_dc
spelling	my-usm-ep.418792019-04-12T05:26:33Z Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process 2011-06 Ang , Karen Huei Ling TN1-997 Mining engineering. Metallurgy Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay could change the profile of the structures and residues of precursor might leave on the film. In Infineon technologies, those wafers are scrapped if time delay exceeded 5 hours and every scrapped cost RM37500. As such, a study is carried out to investigate the effect of time delay in photolithography process to the cured polyimide film. 2011-06 Thesis http://eprints.usm.my/41879/ http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TN1-997 Mining engineering Metallurgy
spellingShingle	TN1-997 Mining engineering Metallurgy Ang , Karen Huei Ling Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
description	Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay could change the profile of the structures and residues of precursor might leave on the film. In Infineon technologies, those wafers are scrapped if time delay exceeded 5 hours and every scrapped cost RM37500. As such, a study is carried out to investigate the effect of time delay in photolithography process to the cured polyimide film.
format	Thesis
qualification_level	Master's degree
author	Ang , Karen Huei Ling
author_facet	Ang , Karen Huei Ling
author_sort	Ang , Karen Huei Ling
title	Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_short	Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_full	Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_fullStr	Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_full_unstemmed	Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_sort	investigation of process time-delay on polyimide with different thicknesses for photolithography process
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
publishDate	2011
url	http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf
_version_	1747820988024750080

Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

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