CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods

The major trend in electronic industry is to make the products smarter, lighter, functional and highly compact, at the same time cheaper. This trend has necessitated stringent packaging requirements and the flip-chip technology has emerged as a promising option to tackle this issue. However, a seri...

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Main Author:	Khor , Chu Yee
Format:	Thesis
Language:	English
Published:	2010
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41905/1/KHOR_CHU_YEE.pdf
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id	my-usm-ep.41905
record_format	uketd_dc
spelling	my-usm-ep.419052019-04-12T05:26:52Z CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods 2010-05 Khor , Chu Yee TJ1-1570 Mechanical engineering and machinery The major trend in electronic industry is to make the products smarter, lighter, functional and highly compact, at the same time cheaper. This trend has necessitated stringent packaging requirements and the flip-chip technology has emerged as a promising option to tackle this issue. However, a serious issue in flip-chip packaging is the difference in the coefficient of thermal expansion between the silicon chip and the organic substrate, which generates thermo-mechanical stresses and causes fatigue in solder joints. This problem is effectively solved by the underfill process in which the space between the silicon die and the PCB is filled with the underfill encapsulant that redistributes the induced stresses thereby enhancing the solder joints reliability. 2010-05 Thesis http://eprints.usm.my/41905/ http://eprints.usm.my/41905/1/KHOR_CHU_YEE.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuteraan Makanikal
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TJ1-1570 Mechanical engineering and machinery
spellingShingle	TJ1-1570 Mechanical engineering and machinery Khor , Chu Yee CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
description	The major trend in electronic industry is to make the products smarter, lighter, functional and highly compact, at the same time cheaper. This trend has necessitated stringent packaging requirements and the flip-chip technology has emerged as a promising option to tackle this issue. However, a serious issue in flip-chip packaging is the difference in the coefficient of thermal expansion between the silicon chip and the organic substrate, which generates thermo-mechanical stresses and causes fatigue in solder joints. This problem is effectively solved by the underfill process in which the space between the silicon die and the PCB is filled with the underfill encapsulant that redistributes the induced stresses thereby enhancing the solder joints reliability.
format	Thesis
qualification_level	Master's degree
author	Khor , Chu Yee
author_facet	Khor , Chu Yee
author_sort	Khor , Chu Yee
title	CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
title_short	CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
title_full	CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
title_fullStr	CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
title_full_unstemmed	CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
title_sort	cfd simulation of underfill encapsulation process in flip chip packaging with various dispensing methods
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuteraan Makanikal
publishDate	2010
url	http://eprints.usm.my/41905/1/KHOR_CHU_YEE.pdf
_version_	1747820993414430720

CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods

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