Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging

Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package...

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Main Author:	Law, Ruen Ching
Format:	Thesis
Language:	English
Published:	2012
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf
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id	my-usm-ep.41921
record_format	uketd_dc
spelling	my-usm-ep.419212019-04-12T05:26:23Z Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging 2012-03 Law, Ruen Ching TJ1-1570 Mechanical engineering and machinery Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package structure and material selection. Stacked dies electronic package is an economical and good electrical performance innovation but inherent thermal problems which caused by thermal crosstalk. Recent methodology for numerical method and measurement method for thermal analysis in QFN and stacked dies LBGA is labor intensive, needs huge amount of investment and requires expert’s knowledge. 2012-03 Thesis http://eprints.usm.my/41921/ http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuteraan Makanikal
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TJ1-1570 Mechanical engineering and machinery
spellingShingle	TJ1-1570 Mechanical engineering and machinery Law, Ruen Ching Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
description	Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package structure and material selection. Stacked dies electronic package is an economical and good electrical performance innovation but inherent thermal problems which caused by thermal crosstalk. Recent methodology for numerical method and measurement method for thermal analysis in QFN and stacked dies LBGA is labor intensive, needs huge amount of investment and requires expert’s knowledge.
format	Thesis
qualification_level	Master's degree
author	Law, Ruen Ching
author_facet	Law, Ruen Ching
author_sort	Law, Ruen Ching
title	Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_short	Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_full	Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_fullStr	Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_full_unstemmed	Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_sort	methodologies for thermal analysis in single die and stacked dies electronic packaging
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuteraan Makanikal
publishDate	2012
url	http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf
_version_	1747820997332959232

Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging

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