Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures

Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures

Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit...

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Main Author: Hashim, Md. Amin
Format: Thesis
Language:English
Published: 2011
Subjects:
TN1-997 Mining engineering
Metallurgy
Online Access:http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf
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spelling my-usm-ep.420082019-04-12T05:26:40Z Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures 2011-01 Hashim, Md. Amin TN1-997 Mining engineering. Metallurgy Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit boards with assembled components. Bulk specimens of 63Sn37Pn solder alloy were subjected to isothermal fatigue at three mildly elevated temperatures (30, 40 and 50oC), loading frequencies (6, 60 and 600 CPM) and at different applied peak stresses (ranging from 8.75 to 33.25 MPa). 2011-01 Thesis http://eprints.usm.my/42008/ http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
institution Universiti Sains Malaysia
collection USM Institutional Repository
language English
topic TN1-997 Mining engineering
Metallurgy
spellingShingle TN1-997 Mining engineering
Metallurgy
Hashim, Md. Amin
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
description Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit boards with assembled components. Bulk specimens of 63Sn37Pn solder alloy were subjected to isothermal fatigue at three mildly elevated temperatures (30, 40 and 50oC), loading frequencies (6, 60 and 600 CPM) and at different applied peak stresses (ranging from 8.75 to 33.25 MPa).
format Thesis
qualification_name Doctor of Philosophy (PhD.)
qualification_level Doctorate
author Hashim, Md. Amin
author_facet Hashim, Md. Amin
author_sort Hashim, Md. Amin
title Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_short Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_full Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_fullStr Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_full_unstemmed Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_sort creep and isothermal fatigue behaviour of eutectic snpb, snbi and snzn solders for microelectronic packaging at mildly elevated temperatures
granting_institution Universiti Sains Malaysia
granting_department Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
publishDate 2011
url http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf
_version_ 1747821012524728320

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