Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the...
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2010
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my-usm-ep.423922019-04-12T05:26:59Z Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views 2010 Ong , Teng Yeow TJ1-1570 Mechanical engineering and machinery Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the soldering conditions. These characteristics have posted a challenging task to develop an effective machine vision with acceptable level of classification accuracy. This research aims to investigate a new methodology of inspecting solder joint through analysis of the combined image from two viewing directions; one from orthogonal view while the other from oblique view. The concept based on the physics of surface tension, contact angle and slant angle of solder joint fillet. 2010 Thesis http://eprints.usm.my/42392/ http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal |
| institution |
Universiti Sains Malaysia |
| collection |
USM Institutional Repository |
| language |
English |
| topic |
TJ1-1570 Mechanical engineering and machinery |
| spellingShingle |
TJ1-1570 Mechanical engineering and machinery Ong , Teng Yeow Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views |
| description |
Machine vision has been widely deployed in many industrial applications.
However, the use of machine vision to perform solder joint inspection of electronic
assembly has yet to reach the desired maturity level. Solder joint surfaces are minute,
curved and the shapes tend to vary greatly with the soldering conditions. These
characteristics have posted a challenging task to develop an effective machine vision
with acceptable level of classification accuracy. This research aims to investigate a
new methodology of inspecting solder joint through analysis of the combined image
from two viewing directions; one from orthogonal view while the other from oblique
view. The concept based on the physics of surface tension, contact angle and slant
angle of solder joint fillet. |
| format |
Thesis |
| qualification_name |
Doctor of Philosophy (PhD.) |
| qualification_level |
Doctorate |
| author |
Ong , Teng Yeow |
| author_facet |
Ong , Teng Yeow |
| author_sort |
Ong , Teng Yeow |
| title |
Application Of Machine Vision On Solder Joint Inspection
Using Orthogonal And Oblique Views
|
| title_short |
Application Of Machine Vision On Solder Joint Inspection
Using Orthogonal And Oblique Views
|
| title_full |
Application Of Machine Vision On Solder Joint Inspection
Using Orthogonal And Oblique Views
|
| title_fullStr |
Application Of Machine Vision On Solder Joint Inspection
Using Orthogonal And Oblique Views
|
| title_full_unstemmed |
Application Of Machine Vision On Solder Joint Inspection
Using Orthogonal And Oblique Views
|
| title_sort |
application of machine vision on solder joint inspection
using orthogonal and oblique views |
| granting_institution |
Universiti Sains Malaysia |
| granting_department |
Pusat Pengajian Kejuruteraan Mekanikal |
| publishDate |
2010 |
| url |
http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf |
| _version_ |
1747821062185287680 |