Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the...
Saved in:
Main Author: | Ong , Teng Yeow |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2010
|
Subjects: | |
Online Access: | http://eprints.usm.my/42392/1/Ong_Teng_Yeow24.pdf |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
The Finite Element Stress Analysis Of
Oblique Pressure Vessel Nozzles
by: Yau , Yat Huang
Published: (1995) -
Machine Vision Application For Automatic Defect
Segmentation In Weld Radiographs
by: Soo , Say Leong
Published: (2006) -
Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape
by: Lim, Shaw Fa
Published: (2020) -
In Process Roughness Measurement And Tool Nose Radius Wear Assesment In Finish Turning Using Machine Vision
by: Balasundaram, Mohan Kumar
Published: (2017) -
Mechanics of solder joints and solder
by: M. Nor, Fethma
Published: (2009)