Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders

Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wetta...

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Main Author:	Wahab, Abdul Karim Abdul
Format:	Thesis
Language:	English
Published:	2011
Subjects:	TN1-997 Mining engineering Metallurgy
Online Access:	http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf
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id	my-usm-ep.43190
record_format	uketd_dc
spelling	my-usm-ep.431902019-04-12T05:26:38Z Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders 2011-05 Wahab, Abdul Karim Abdul TN1-997 Mining engineering. Metallurgy Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wettability, excellent physical and mechanical properties. This thesis is devoted to the research and development of lead-free Sn-Bi and SAC based solder alloy for microelectronic packaging applications. A systematic study was conducted on the solders characteristics, wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of solders on Cu and Ni-P substrate. 2011-05 Thesis http://eprints.usm.my/43190/ http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TN1-997 Mining engineering Metallurgy
spellingShingle	TN1-997 Mining engineering Metallurgy Wahab, Abdul Karim Abdul Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
description	Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wettability, excellent physical and mechanical properties. This thesis is devoted to the research and development of lead-free Sn-Bi and SAC based solder alloy for microelectronic packaging applications. A systematic study was conducted on the solders characteristics, wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of solders on Cu and Ni-P substrate.
format	Thesis
qualification_level	Master's degree
author	Wahab, Abdul Karim Abdul
author_facet	Wahab, Abdul Karim Abdul
author_sort	Wahab, Abdul Karim Abdul
title	Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
title_short	Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
title_full	Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
title_fullStr	Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
title_full_unstemmed	Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
title_sort	intermetallic compound and reliability study of sac and snbi lead free solders
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
publishDate	2011
url	http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf
_version_	1747821177541230592

Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders

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