Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process

The rapid development of portable electronic devices, such as iPad, iPhone, iPod, and laptop, propels the integrated circuit (IC) packaging technology toward miniaturization characterized by high capacity and compactness of IC package. The scaling down of IC package size has given challenges to the...

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Main Author:	Khor, Chu Yee
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/43379/1/Khor%20Chu%20Yee24.pdf
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id	my-usm-ep.43379
record_format	uketd_dc
spelling	my-usm-ep.433792019-04-12T05:26:17Z Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process 2013-04 Khor, Chu Yee TJ1-1570 Mechanical engineering and machinery The rapid development of portable electronic devices, such as iPad, iPhone, iPod, and laptop, propels the integrated circuit (IC) packaging technology toward miniaturization characterized by high capacity and compactness of IC package. The scaling down of IC package size has given challenges to the engineers and IC designers in maintaining package reliability. In moulded underfill (MUF) process, the interaction between fluid (EMC) and structure (silicon chip and solder bump) yields unintended deformation and stress that may cause defects and reduce package reliability. Thus, the understanding of the FSI phenomenon is essential for the engineers and IC designers to tackle these problems. Therefore, the MUF process considering FSI aspect was the focus of this research. The FSI simulation was performed by finite volume based (FLUENT) and finite element based (ABAQUS) software through the MpCCI coupling technique for the simultaneous analysis. The capability of the software in handling encapsulation problems was examined by comparing the predicted results with previous scholars’ works and the current scaled-up MUF encapsulation processes. The scaled-up MUF encapsulation processes were fabricated in transparent for better visualization of FSI phenomenon, flow and void formation mechanisms. In the simulation, the Castro-Macosko viscosity model was written into UDFs to describe the EMC fluid behaviour. The accurateness of the UDFs has been proven excellent in modelling the rheological fluid behaviour during the encapsulation process. 2013-04 Thesis http://eprints.usm.my/43379/ http://eprints.usm.my/43379/1/Khor%20Chu%20Yee24.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TJ1-1570 Mechanical engineering and machinery
spellingShingle	TJ1-1570 Mechanical engineering and machinery Khor, Chu Yee Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
description	The rapid development of portable electronic devices, such as iPad, iPhone, iPod, and laptop, propels the integrated circuit (IC) packaging technology toward miniaturization characterized by high capacity and compactness of IC package. The scaling down of IC package size has given challenges to the engineers and IC designers in maintaining package reliability. In moulded underfill (MUF) process, the interaction between fluid (EMC) and structure (silicon chip and solder bump) yields unintended deformation and stress that may cause defects and reduce package reliability. Thus, the understanding of the FSI phenomenon is essential for the engineers and IC designers to tackle these problems. Therefore, the MUF process considering FSI aspect was the focus of this research. The FSI simulation was performed by finite volume based (FLUENT) and finite element based (ABAQUS) software through the MpCCI coupling technique for the simultaneous analysis. The capability of the software in handling encapsulation problems was examined by comparing the predicted results with previous scholars’ works and the current scaled-up MUF encapsulation processes. The scaled-up MUF encapsulation processes were fabricated in transparent for better visualization of FSI phenomenon, flow and void formation mechanisms. In the simulation, the Castro-Macosko viscosity model was written into UDFs to describe the EMC fluid behaviour. The accurateness of the UDFs has been proven excellent in modelling the rheological fluid behaviour during the encapsulation process.
format	Thesis
qualification_name	Doctor of Philosophy (PhD.)
qualification_level	Doctorate
author	Khor, Chu Yee
author_facet	Khor, Chu Yee
author_sort	Khor, Chu Yee
title	Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
title_short	Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
title_full	Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
title_fullStr	Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
title_full_unstemmed	Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
title_sort	investigation of the fluid/structure interaction in moulded underfill process
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Mekanikal
publishDate	2013
url	http://eprints.usm.my/43379/1/Khor%20Chu%20Yee24.pdf
_version_	1747821204165623808

Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process

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