Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier

LEDs are the ultimate light source in the lighting technology and growing at double digit percentage for the past few decades. Despite of many virtues in LEDs, there are many challenges it have. One of it is die crack. In this work, the focus is on die-crack on die substrate of an AlInGaP LED at die...

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Main Author:	Annaniah, Luruthudass
Format:	Thesis
Language:	English
Published:	2018
Subjects:	QC1 Physics (General)
Online Access:	http://eprints.usm.my/43666/1/LURUTHUDASS%20ANNANIAH.pdf
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id	my-usm-ep.43666
record_format	uketd_dc
spelling	my-usm-ep.436662020-10-08T03:18:40Z Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier 2018-02 Annaniah, Luruthudass QC1 Physics (General) LEDs are the ultimate light source in the lighting technology and growing at double digit percentage for the past few decades. Despite of many virtues in LEDs, there are many challenges it have. One of it is die crack. In this work, the focus is on die-crack on die substrate of an AlInGaP LED at die attach (DA) process. Here the impact on electro-optical and thermal properties were investigated and a detection method was invented. The cracks were artificially created at Ge substrate using industrial grade DA equipment at bond force range from 40gF to 210gF. Die-crack length were measured using high magnification scope. 2018-02 Thesis http://eprints.usm.my/43666/ http://eprints.usm.my/43666/1/LURUTHUDASS%20ANNANIAH.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Sains Fizik
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	QC1 Physics (General)
spellingShingle	QC1 Physics (General) Annaniah, Luruthudass Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier
description	LEDs are the ultimate light source in the lighting technology and growing at double digit percentage for the past few decades. Despite of many virtues in LEDs, there are many challenges it have. One of it is die crack. In this work, the focus is on die-crack on die substrate of an AlInGaP LED at die attach (DA) process. Here the impact on electro-optical and thermal properties were investigated and a detection method was invented. The cracks were artificially created at Ge substrate using industrial grade DA equipment at bond force range from 40gF to 210gF. Die-crack length were measured using high magnification scope.
format	Thesis
qualification_name	Doctor of Philosophy (PhD.)
qualification_level	Doctorate
author	Annaniah, Luruthudass
author_facet	Annaniah, Luruthudass
author_sort	Annaniah, Luruthudass
title	Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier
title_short	Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier
title_full	Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier
title_fullStr	Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier
title_full_unstemmed	Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier
title_sort	development of inline rapid thermal transient test system for crack detection of alingap on germanium carrier
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Sains Fizik
publishDate	2018
url	http://eprints.usm.my/43666/1/LURUTHUDASS%20ANNANIAH.pdf
_version_	1747821258645438464

Development Of Inline Rapid Thermal Transient Test System For Crack Detection Of Alingap On Germanium Carrier

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