Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes

A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency,...

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Main Author: Mah, Jian Wen
Format: Thesis
Language:English
Published: 2018
Subjects:
Online Access:http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf
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spelling my-usm-ep.442232019-04-26T01:35:25Z Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes 2018-04 Mah, Jian Wen QC1 Physics (General) A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency, shorter life time, shifting of emission wavelength and reliability issues. Typically, the junction temperature of the LED was found to be approximately 120°C on 250mA of applied forward current. In this project, pure and four different metal-doped ZnO thick films were deposited on Aluminium substrate by screen printing technique using nano-crystalline powder synthesized from co-precipitation method. 2018-04 Thesis http://eprints.usm.my/44223/ http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Sains Fizik
institution Universiti Sains Malaysia
collection USM Institutional Repository
language English
topic QC1 Physics (General)
spellingShingle QC1 Physics (General)
Mah, Jian Wen
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
description A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency, shorter life time, shifting of emission wavelength and reliability issues. Typically, the junction temperature of the LED was found to be approximately 120°C on 250mA of applied forward current. In this project, pure and four different metal-doped ZnO thick films were deposited on Aluminium substrate by screen printing technique using nano-crystalline powder synthesized from co-precipitation method.
format Thesis
qualification_level Master's degree
author Mah, Jian Wen
author_facet Mah, Jian Wen
author_sort Mah, Jian Wen
title Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_short Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_full Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_fullStr Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_full_unstemmed Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_sort fabrication of screen printed doped zinc oxide thick film on metal substrate as heat sink for high power light emitting diodes
granting_institution Universiti Sains Malaysia
granting_department Pusat Pengajian Sains Fizik
publishDate 2018
url http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf
_version_ 1747821342142496768