Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency,...
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my-usm-ep.442232019-04-26T01:35:25Z Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes 2018-04 Mah, Jian Wen QC1 Physics (General) A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency, shorter life time, shifting of emission wavelength and reliability issues. Typically, the junction temperature of the LED was found to be approximately 120°C on 250mA of applied forward current. In this project, pure and four different metal-doped ZnO thick films were deposited on Aluminium substrate by screen printing technique using nano-crystalline powder synthesized from co-precipitation method. 2018-04 Thesis http://eprints.usm.my/44223/ http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Sains Fizik |
| institution |
Universiti Sains Malaysia |
| collection |
USM Institutional Repository |
| language |
English |
| topic |
QC1 Physics (General) |
| spellingShingle |
QC1 Physics (General) Mah, Jian Wen Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes |
| description |
A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency, shorter life time, shifting of emission wavelength and reliability issues. Typically, the junction temperature of the LED was found to be approximately 120°C on 250mA of applied forward current. In this project, pure and four different metal-doped ZnO thick films were deposited on Aluminium substrate by screen printing technique using nano-crystalline powder synthesized from co-precipitation method. |
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Mah, Jian Wen |
| author_facet |
Mah, Jian Wen |
| author_sort |
Mah, Jian Wen |
| title |
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes |
| title_short |
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes |
| title_full |
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes |
| title_fullStr |
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes |
| title_full_unstemmed |
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes |
| title_sort |
fabrication of screen printed doped zinc oxide thick film on metal substrate as heat sink for high power light emitting diodes |
| granting_institution |
Universiti Sains Malaysia |
| granting_department |
Pusat Pengajian Sains Fizik |
| publishDate |
2018 |
| url |
http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf |
| _version_ |
1747821342142496768 |