Simulation Of Underfill Encapsulation Of Electrionic Packaging Using The Lattice-Boltzmann Method
Kebanyak kajian berasaskan kaedah isipadu terhingga (FVM) telah dilaksanakan untuk mengoptimumkan dan memperbaiki proses pengkapsulan isian bawah. Namun, terdapat kajian yang terhad telah dilaksanakan dengan kaedah kekisi-Boltzmann (LBM) untuk aplikasi yang berkaitan dengan pengkapsulan isian bawah....
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Main Author: | Gan, Zhong Li |
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Format: | Thesis |
Language: | English |
Published: |
2018
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Subjects: | |
Online Access: | http://eprints.usm.my/44590/1/Simulation%20Of%20Underfill%20Encapsulation%20Of%20Electrionic%20Packaging%20Using%20The%20Lattice-Boltzmann%20Method.pdf |
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