Fabrication And Properties Of Silica-Epoxy Thin Film Composite

Fabrication And Properties Of Silica-Epoxy Thin Film Composite

With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

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Main Author: Foo, Yin Lin Evon
Format: Thesis
Language:English
Published: 2012
Subjects:
TN1-997 Mining engineering
Metallurgy
Online Access:http://eprints.usm.my/44803/1/FOO%20YIN%20LIN%20EVON.pdf
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spelling my-usm-ep.448032019-07-02T01:31:45Z Fabrication And Properties Of Silica-Epoxy Thin Film Composite 2012-06 Foo, Yin Lin Evon TN1-997 Mining engineering. Metallurgy With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of the thin film composites using micron-silica (µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film composites was found to have the ability to achieve equivalent tensile and thermal properties compared to the highly loaded µ-Si thin film composite. With higher surface area to volume ratio, n-Si shows its capability to achieve a substantial performance with-Si. 2012-06 Thesis http://eprints.usm.my/44803/ http://eprints.usm.my/44803/1/FOO%20YIN%20LIN%20EVON.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
institution Universiti Sains Malaysia
collection USM Institutional Repository
language English
topic TN1-997 Mining engineering
Metallurgy
spellingShingle TN1-997 Mining engineering
Metallurgy
Foo, Yin Lin Evon
Fabrication And Properties Of Silica-Epoxy Thin Film Composite
description With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of the thin film composites using micron-silica (µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film composites was found to have the ability to achieve equivalent tensile and thermal properties compared to the highly loaded µ-Si thin film composite. With higher surface area to volume ratio, n-Si shows its capability to achieve a substantial performance with-Si.
format Thesis
qualification_level Master's degree
author Foo, Yin Lin Evon
author_facet Foo, Yin Lin Evon
author_sort Foo, Yin Lin Evon
title Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_short Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_full Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_fullStr Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_full_unstemmed Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_sort fabrication and properties of silica-epoxy thin film composite
granting_institution Universiti Sains Malaysia
granting_department Pusat Pengajian Kejuteraan Bahan & Sumber Mineral
publishDate 2012
url http://eprints.usm.my/44803/1/FOO%20YIN%20LIN%20EVON.pdf
_version_ 1747821402449248256

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