Yong, K. C. (2013). High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package.
Chicago Style (17th ed.) CitationYong, Khang Choong. High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package. 2013.
MLA引文Yong, Khang Choong. High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package. 2013.
警告:这些引文格式不一定是100%准确.