High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package
Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. The vast adoptions of this technology are mainly contributed by the advantages for instance lower power consumption, heterogeneous integration of multiple silicon process te...
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| 主要作者: | |
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| 格式: | Thesis |
| 語言: | English |
| 出版: |
2013
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| 主題: | |
| 在線閱讀: | http://eprints.usm.my/45230/1/Yong%20Khang%20Choong24.pdf |
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