High Frequency Signaling Analysis
Of Inter-Chip Package Routing
For Multi-Chip Package

High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package

Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. The vast adoptions of this technology are mainly contributed by the advantages for instance lower power consumption, heterogeneous integration of multiple silicon process te...

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書目詳細資料
主要作者:	Yong, Khang Choong
格式:	Thesis
語言:	English
出版:	2013
主題:	TK1-9971 Electrical engineering Electronics Nuclear engineering
在線閱讀:	http://eprints.usm.my/45230/1/Yong%20Khang%20Choong24.pdf
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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