Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application

Properties of Sn-9Zn and Bi-48.8In-19.6Sn solder alloys have been investigated along with Sn-40Pb as a reference. The solder alloys where characterized (density, XRD, SEM, CTE and DSC) before the atomization process. The characterized solder alloys are then gas atomized at a pressure of 0.4 MPa and...

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Main Author:	Bakir, Mohammed Luay
Format:	Thesis
Language:	English
Published:	2012
Subjects:	TN1-997 Mining engineering Metallurgy
Online Access:	http://eprints.usm.my/45529/1/MOHAMMED%20LUAY%20BAKIR_HJ.pdf
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spelling	my-usm-ep.455292019-09-24T02:56:49Z Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application 2012-01 Bakir, Mohammed Luay TN1-997 Mining engineering. Metallurgy Properties of Sn-9Zn and Bi-48.8In-19.6Sn solder alloys have been investigated along with Sn-40Pb as a reference. The solder alloys where characterized (density, XRD, SEM, CTE and DSC) before the atomization process. The characterized solder alloys are then gas atomized at a pressure of 0.4 MPa and superheat temperature of 20% above their respective liquidus temperature obtained from the DSC analysis. Solder powders are then sieved and characterized using SEM and particle size analyzer. The characterized powders of size +75-150 μm are then mixed with zinc chloride flux at different metal to flux ratios (90:10, 80:20, 70:30, and 60:40). The wetting properties (spreading and contact angle), interfacial reactions and mechanical property (shear test) of the solder pastes are then studied. The Sn-40Pb solder paste demonstrates the highest spreading and lowest contact angle compared to Sn-9Zn and Bi-48.8In-19.6Sn. At the solder/substrate interface, the intermetallic compound Cu6Sn5 was formed for both Sn-40Pb and Bi-48.8In-19.6Sn regardless of metal content and Sn-Cu-Zn intermetallic compound is formed at the Sn-9Zn (90 wt%)/Cu interface. The highest joint shear strength was achieved by Sn-9Zn (90 wt%) at a value of 45.3 MPa. The shear strength increased as the metal content increases for the Sn-40Pb and Bi-48.8In-19.6Sn solder alloys. The shear strength of Sn-40Pb (90 wt%) is higher than the shear strength of Sn-40Pb (80 wt%) and the same goes for Bi-48.8In-19.6Sn solder alloy where the shear strength of Bi-48.8In-19.6Sn (90 wt%) is higher than the shear strength of Bi-48.8In-19.6Sn (80 wt%). 2012-01 Thesis http://eprints.usm.my/45529/ http://eprints.usm.my/45529/1/MOHAMMED%20LUAY%20BAKIR_HJ.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TN1-997 Mining engineering Metallurgy
spellingShingle	TN1-997 Mining engineering Metallurgy Bakir, Mohammed Luay Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
description	Properties of Sn-9Zn and Bi-48.8In-19.6Sn solder alloys have been investigated along with Sn-40Pb as a reference. The solder alloys where characterized (density, XRD, SEM, CTE and DSC) before the atomization process. The characterized solder alloys are then gas atomized at a pressure of 0.4 MPa and superheat temperature of 20% above their respective liquidus temperature obtained from the DSC analysis. Solder powders are then sieved and characterized using SEM and particle size analyzer. The characterized powders of size +75-150 μm are then mixed with zinc chloride flux at different metal to flux ratios (90:10, 80:20, 70:30, and 60:40). The wetting properties (spreading and contact angle), interfacial reactions and mechanical property (shear test) of the solder pastes are then studied. The Sn-40Pb solder paste demonstrates the highest spreading and lowest contact angle compared to Sn-9Zn and Bi-48.8In-19.6Sn. At the solder/substrate interface, the intermetallic compound Cu6Sn5 was formed for both Sn-40Pb and Bi-48.8In-19.6Sn regardless of metal content and Sn-Cu-Zn intermetallic compound is formed at the Sn-9Zn (90 wt%)/Cu interface. The highest joint shear strength was achieved by Sn-9Zn (90 wt%) at a value of 45.3 MPa. The shear strength increased as the metal content increases for the Sn-40Pb and Bi-48.8In-19.6Sn solder alloys. The shear strength of Sn-40Pb (90 wt%) is higher than the shear strength of Sn-40Pb (80 wt%) and the same goes for Bi-48.8In-19.6Sn solder alloy where the shear strength of Bi-48.8In-19.6Sn (90 wt%) is higher than the shear strength of Bi-48.8In-19.6Sn (80 wt%).
format	Thesis
qualification_level	Master's degree
author	Bakir, Mohammed Luay
author_facet	Bakir, Mohammed Luay
author_sort	Bakir, Mohammed Luay
title	Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
title_short	Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
title_full	Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
title_fullStr	Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
title_full_unstemmed	Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
title_sort	atomized lead free solder alloys for solder paste product for electronic application
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
publishDate	2012
url	http://eprints.usm.my/45529/1/MOHAMMED%20LUAY%20BAKIR_HJ.pdf
_version_	1747821528910659584

Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application

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