Time Domain Reflection Method To Detect Copper Wire Micro Crack Weld Defect

Structural integrity of wire bonding interconnection is having a significant impact on the quality of microelectronic devices. Conventional electrical test methodology is unable to detect 1 to 20 m of cracks that exists in wire bond stitch weld. This micro crack has becomes prominent in Power MO...

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Bibliographic Details
Main Author: Robin, Ong Su Kiat
Format: Thesis
Language:English
Published: 2016
Subjects:
Online Access:http://eprints.usm.my/45796/1/Time%20Domain%20Reflection%20Method%20To%20Detect%20Copper%20Wire%20Micro%20Crack%20Weld%20Defect.pdf
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