Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip

One of the issues in designing a disposable DNA biochip based on capillary electrophoresis technology is the leakage of fluid in the microchannel though small gaps between electrodes. In this work a leakagefree and reusable biochip is designed for DNA separation and detection applications. The b...

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Main Author:	Ali @ Hasim, Norshah Rizal
Format:	Thesis
Language:	English
Published:	2017
Subjects:	T Technology
Online Access:	http://eprints.usm.my/46440/1/Investigation%20Of%20Irreversible%20Bonding%20Between%20Polydimethylsiloxane%20And%20Printed%20Circuit%20Board%20For%20Designing%20Leakage-Free%20Dna%20Biochip.pdf
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spelling	my-usm-ep.464402021-11-17T03:42:16Z Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip 2017-03-01 Ali @ Hasim, Norshah Rizal T Technology TK1-9971 Electrical engineering. Electronics. Nuclear engineering One of the issues in designing a disposable DNA biochip based on capillary electrophoresis technology is the leakage of fluid in the microchannel though small gaps between electrodes. In this work a leakagefree and reusable biochip is designed for DNA separation and detection applications. The biochip comprises PDMS microfluidic structure fabricated with soft-lithography and copper electrodes which are engraved on FR-4 board with standard semi-automatic processes. An inhibitive layer made from photocurable diacrylate bisphenol A polymer (DABA) is used to establish irreversible bonding between PDMS and PCB substrates. Pull-off tests resulted in an average tensile strength of 287.357 kPa and standard deviation ± 23.793 kPa. These results are comparable to PDMS–PDMS bonding via conventional oxygen plasma and corona discharge. Meanwhile the leakage test showed that the microchannel could withstand pressure of more than 189 kPa which is sufficiently high for most biochip applications. Finally experiments performed on single DNA band produced by using PCR and multiple bands from standard DNA ladders indicated that the proposed design can accurately separate DNA fragments with current sensitivity consistently higher than 100 nA and at electric field strength of 20V/cm. Comparing to the previous design that used clips to mechanically clamp PDMS and PCB substrates, the new approach effectively seals the device, thus preventing leakage of liquid from the sensor matrix. This together with the electrochemically inert characteristics of the photopolymer inhibitor, open up possibilities in designing a truly portable bio-sensing device. 2017-03 Thesis http://eprints.usm.my/46440/ http://eprints.usm.my/46440/1/Investigation%20Of%20Irreversible%20Bonding%20Between%20Polydimethylsiloxane%20And%20Printed%20Circuit%20Board%20For%20Designing%20Leakage-Free%20Dna%20Biochip.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Elektrik & Elektronik
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology T Technology
spellingShingle	T Technology T Technology Ali @ Hasim, Norshah Rizal Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
description	One of the issues in designing a disposable DNA biochip based on capillary electrophoresis technology is the leakage of fluid in the microchannel though small gaps between electrodes. In this work a leakagefree and reusable biochip is designed for DNA separation and detection applications. The biochip comprises PDMS microfluidic structure fabricated with soft-lithography and copper electrodes which are engraved on FR-4 board with standard semi-automatic processes. An inhibitive layer made from photocurable diacrylate bisphenol A polymer (DABA) is used to establish irreversible bonding between PDMS and PCB substrates. Pull-off tests resulted in an average tensile strength of 287.357 kPa and standard deviation ± 23.793 kPa. These results are comparable to PDMS–PDMS bonding via conventional oxygen plasma and corona discharge. Meanwhile the leakage test showed that the microchannel could withstand pressure of more than 189 kPa which is sufficiently high for most biochip applications. Finally experiments performed on single DNA band produced by using PCR and multiple bands from standard DNA ladders indicated that the proposed design can accurately separate DNA fragments with current sensitivity consistently higher than 100 nA and at electric field strength of 20V/cm. Comparing to the previous design that used clips to mechanically clamp PDMS and PCB substrates, the new approach effectively seals the device, thus preventing leakage of liquid from the sensor matrix. This together with the electrochemically inert characteristics of the photopolymer inhibitor, open up possibilities in designing a truly portable bio-sensing device.
format	Thesis
qualification_level	Master's degree
author	Ali @ Hasim, Norshah Rizal
author_facet	Ali @ Hasim, Norshah Rizal
author_sort	Ali @ Hasim, Norshah Rizal
title	Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
title_short	Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
title_full	Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
title_fullStr	Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
title_full_unstemmed	Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
title_sort	investigation of irreversible bonding between polydimethylsiloxane and printed circuit board for designing leakage-free dna biochip
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Elektrik & Elektronik
publishDate	2017
url	http://eprints.usm.my/46440/1/Investigation%20Of%20Irreversible%20Bonding%20Between%20Polydimethylsiloxane%20And%20Printed%20Circuit%20Board%20For%20Designing%20Leakage-Free%20Dna%20Biochip.pdf
_version_	1747821671266385920

Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip

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