Two Dimensional (2d) Nanofabrication Process On Quartz Substrate
The fabrication of nanostructures on a quartz substrate has attracted the attention and interest of researchers in recent years due to its wide range of potential applications such as for NEMS/MEMS including BioMEMS/BioNEMS, sensor and fuel cell electrodes. It would create several new potential d...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | http://eprints.usm.my/46910/1/Two%20Dimensional%20%282d%29%20Nanofabrication%20Process%20On%20Quartz%20Substrate.pdf |
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| Summary: | The fabrication of nanostructures on a quartz substrate has attracted the
attention and interest of researchers in recent years due to its wide range of potential
applications such as for NEMS/MEMS including BioMEMS/BioNEMS, sensor and
fuel cell electrodes. It would create several new potential due to the excellent
properties of quartz in hardness, ability to withstand high temperatures, having high
UV transmission and piezoelectric properties- which is a capability to develop an
electric potential upon the application of mechanical stress. However, there is limited
information of 2D fabricating process on insulating materials such as quartz
substrate. Various types of modern lithography methods have been explored because
optical lithography physical limitations have hindered the fabrication of
nanostructure. Electron beam lithography (EBL) is one of the most commonly used
techniques for direct patterning at the nanoscale meter range that enables the
nanofabrication of structures and devices in the research field about nanoscience and
nanotechnology. The reactive ion etching (RIE) method is usually utilized in process
transfer of 2D or 3D structures due to the ability of directional etching. Combination
of inductively coupled plasma (ICP) with reactive ion etching (RIE) could boost the
densities of the plasma and enhance etch rate during pattern transfer process. The
fundamental study conducted in this research can contributes to the existing
knowledge and understanding on this crucial process in nanofabrication technology.
In this study, a top-down fabrication approach was applied. In this approach, pattern
definition process uses the EBL tool and pattern transfer process by inductively
coupled plasma-reactive ion etching (ICP-RIE) system. The additive pattern transfer
method required for quartz etching, where high resistant mask material was used
during etching process. The factors that influenced the pattern definition process,
including the selection of photoresist, e-beam exposure parameters such as current,
dosage and the developing time were optimised. Meanwhile, the effect of etching
parameters ICP-RIE power and flow rate of etchant gases were investigated during
the pattern transfer process. A single pass line design was defined on bi-layer
polymethyl methacrylate (PMMA). An e-beam dosage of 900 pC/cm was found
suitable for pattern definition on a 200 nm PMMA and was successfully deposited
with nichrome (NiCr) thin film. With that, a 2D pattern was successfully transferred
onto quartz substrate using trifluoromethane (CHF3) and argon (Ar) gases with
etching rate of 14 nm/min. The optical microscopy, atomic force microscope (AFM),
field emission scanning electron microscopy (FESEM) and energy-dispersive X-ray
(EDX) were used to characterize the etched structure profiles. |
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