Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate

Current functional test of assembled device in semiconductor industry use thermal interface media but it occasionally caused cosmetic defects such as stain or scratch mark. A possible solution to eliminate the undesired defects is by improving the nickel-phosphorus (Ni-P) coating currently applied o...

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Main Author:	Md Sani, Nur Ariffah
Format:	Thesis
Language:	English
Published:	2015
Subjects:	T Technology (General)
Online Access:	http://eprints.usm.my/46917/1/Development%20Of%20Ternary%20Ni-Ag-P%20And%20Ni-Cu-P%20Using%20Electroless%20Coating%20On%20Copper%20Substrate.pdf
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spelling	my-usm-ep.469172021-11-17T03:42:18Z Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate 2015-12-01 Md Sani, Nur Ariffah T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials Current functional test of assembled device in semiconductor industry use thermal interface media but it occasionally caused cosmetic defects such as stain or scratch mark. A possible solution to eliminate the undesired defects is by improving the nickel-phosphorus (Ni-P) coating currently applied on the test chuck in terms of the ability to conduct heat transfer efficiently and thus eliminate the use of thermal interface media. Co-deposition of argentum (Ag) and copper (Cu) into Ni-P coating are expected to improve the thermal conductivity of Ni-P coating without sacrificing other coating’s properties; surface roughness, thickness, hardness and wear resistance. Ni-P coating in this work was prepared via electroless coating on a copper substrate. The experimental work began by developing the coating solution in order to achieve targeted phosphorus content, thickness and surface roughness. To produce ternary nickel-argentum-phosphorus (Ni-Ag-P) and nickel-copper-phosphorus (Ni-Cu-P) coating, argentum and copper salt were added into the coating solution. The best ternary coating was observed on coating containing 5 mg/L argentum sulphate and 10 mg/L copper sulphate with co-deposition of 1.14 wt.% Ag and 3.56 wt.% Cu respectively. Both ternary coating produced have smoother surface with lower wear rate compared to binary Ni-P coating. Improvement in wear resistance is related to the hardness of coating, in which Ni-Ag-P has highest hardness (394.08 HK) followed by Ni-P (380.78 HK) and Ni-Cu-P (365.34 HK). Even though Ni-Cu-P coating possess low hardness, its low surface roughness contributed to the low wear rate. The thermal conductivity for ternary Ni-Ag-P coating (451.10 W/m.K) was higher than Ni-P (445.70 W/m.K) and Ni-Cu-P coating (326.91 W/m.K). The result is as expected as argentum has higher conductivity compared to nickel, and thus addition of argentum is able to improve thermal conductivity of Ni-P coating. 2015-12 Thesis http://eprints.usm.my/46917/ http://eprints.usm.my/46917/1/Development%20Of%20Ternary%20Ni-Ag-P%20And%20Ni-Cu-P%20Using%20Electroless%20Coating%20On%20Copper%20Substrate.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology (General) T Technology (General)
spellingShingle	T Technology (General) T Technology (General) Md Sani, Nur Ariffah Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
description	Current functional test of assembled device in semiconductor industry use thermal interface media but it occasionally caused cosmetic defects such as stain or scratch mark. A possible solution to eliminate the undesired defects is by improving the nickel-phosphorus (Ni-P) coating currently applied on the test chuck in terms of the ability to conduct heat transfer efficiently and thus eliminate the use of thermal interface media. Co-deposition of argentum (Ag) and copper (Cu) into Ni-P coating are expected to improve the thermal conductivity of Ni-P coating without sacrificing other coating’s properties; surface roughness, thickness, hardness and wear resistance. Ni-P coating in this work was prepared via electroless coating on a copper substrate. The experimental work began by developing the coating solution in order to achieve targeted phosphorus content, thickness and surface roughness. To produce ternary nickel-argentum-phosphorus (Ni-Ag-P) and nickel-copper-phosphorus (Ni-Cu-P) coating, argentum and copper salt were added into the coating solution. The best ternary coating was observed on coating containing 5 mg/L argentum sulphate and 10 mg/L copper sulphate with co-deposition of 1.14 wt.% Ag and 3.56 wt.% Cu respectively. Both ternary coating produced have smoother surface with lower wear rate compared to binary Ni-P coating. Improvement in wear resistance is related to the hardness of coating, in which Ni-Ag-P has highest hardness (394.08 HK) followed by Ni-P (380.78 HK) and Ni-Cu-P (365.34 HK). Even though Ni-Cu-P coating possess low hardness, its low surface roughness contributed to the low wear rate. The thermal conductivity for ternary Ni-Ag-P coating (451.10 W/m.K) was higher than Ni-P (445.70 W/m.K) and Ni-Cu-P coating (326.91 W/m.K). The result is as expected as argentum has higher conductivity compared to nickel, and thus addition of argentum is able to improve thermal conductivity of Ni-P coating.
format	Thesis
qualification_level	Master's degree
author	Md Sani, Nur Ariffah
author_facet	Md Sani, Nur Ariffah
author_sort	Md Sani, Nur Ariffah
title	Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
title_short	Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
title_full	Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
title_fullStr	Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
title_full_unstemmed	Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
title_sort	development of ternary ni-ag-p and ni-cu-p using electroless coating on copper substrate
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
publishDate	2015
url	http://eprints.usm.my/46917/1/Development%20Of%20Ternary%20Ni-Ag-P%20And%20Ni-Cu-P%20Using%20Electroless%20Coating%20On%20Copper%20Substrate.pdf
_version_	1747821744449650688

Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate

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