Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate
Current functional test of assembled device in semiconductor industry use thermal interface media but it occasionally caused cosmetic defects such as stain or scratch mark. A possible solution to eliminate the undesired defects is by improving the nickel-phosphorus (Ni-P) coating currently applied o...
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| Format: | Thesis |
| Language: | English |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.usm.my/46917/1/Development%20Of%20Ternary%20Ni-Ag-P%20And%20Ni-Cu-P%20Using%20Electroless%20Coating%20On%20Copper%20Substrate.pdf |
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