Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. Howev...

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Main Author:	Lim, Chong Hooi
Format:	Thesis
Language:	English
Published:	2017
Subjects:	T Technology TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/46933/1/Heat%20Transfer%20And%20Deformation%20Of%20Flexible%20Printed%20Circuit%20Board%20With%20Multi%20Ball%20Grid%20Array%20Packages.pdf
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id	my-usm-ep.46933
record_format	uketd_dc
spelling	my-usm-ep.469332021-11-17T03:42:15Z Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages 2017-06-01 Lim, Chong Hooi T Technology TJ1-1570 Mechanical engineering and machinery The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. However, the soft feature of FPCB poses unwanted deflection (δ) and stress from the flow and heat generated by the operating components. In present research, thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated where the numerical simulation with coupled of flow and thermal effects concurrently has been successfully developed in the simulation. The effects of flow are studied at the initial stage of the research, followed by the addition of heat source to the BGA packages. The experimental work with actual attached ball grid array (BGA) packages was carried out to verify and validate the results. Findings show that better heat transfer performance on FPCB with an average 24 % higher than RPCB. Several parametric factors are explored including flow velocities (v) (1 – 5 m/s), 1 - 4 number of BGA packages attached, power supplied to the BGA packages (0 – 0.213 W), size of FPCB (80mm2 – 140mm2) and distance between BGA packages (15 mm – 45 mm). The heat transfer coefficient (h) has been added into the responses to study the heat transfer in the cases that involved heat source. Later on, v, δ and h had been normalized into dimensionless Reynolds number (Re), δ/length of FPCB (L) and Nusselt number ( 2017-06 Thesis http://eprints.usm.my/46933/ http://eprints.usm.my/46933/1/Heat%20Transfer%20And%20Deformation%20Of%20Flexible%20Printed%20Circuit%20Board%20With%20Multi%20Ball%20Grid%20Array%20Packages.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanik
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology TJ1-1570 Mechanical engineering and machinery
spellingShingle	T Technology TJ1-1570 Mechanical engineering and machinery Lim, Chong Hooi Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
description	The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. However, the soft feature of FPCB poses unwanted deflection (δ) and stress from the flow and heat generated by the operating components. In present research, thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated where the numerical simulation with coupled of flow and thermal effects concurrently has been successfully developed in the simulation. The effects of flow are studied at the initial stage of the research, followed by the addition of heat source to the BGA packages. The experimental work with actual attached ball grid array (BGA) packages was carried out to verify and validate the results. Findings show that better heat transfer performance on FPCB with an average 24 % higher than RPCB. Several parametric factors are explored including flow velocities (v) (1 – 5 m/s), 1 - 4 number of BGA packages attached, power supplied to the BGA packages (0 – 0.213 W), size of FPCB (80mm2 – 140mm2) and distance between BGA packages (15 mm – 45 mm). The heat transfer coefficient (h) has been added into the responses to study the heat transfer in the cases that involved heat source. Later on, v, δ and h had been normalized into dimensionless Reynolds number (Re), δ/length of FPCB (L) and Nusselt number (
format	Thesis
qualification_name	Doctor of Philosophy (PhD.)
qualification_level	Doctorate
author	Lim, Chong Hooi
author_facet	Lim, Chong Hooi
author_sort	Lim, Chong Hooi
title	Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
title_short	Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
title_full	Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
title_fullStr	Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
title_full_unstemmed	Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
title_sort	heat transfer and deformation of flexible printed circuit board with multi ball grid array packages
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Mekanik
publishDate	2017
url	http://eprints.usm.my/46933/1/Heat%20Transfer%20And%20Deformation%20Of%20Flexible%20Printed%20Circuit%20Board%20With%20Multi%20Ball%20Grid%20Array%20Packages.pdf
_version_	1747821745429020672

Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

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