Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. Howev...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 语言: | English |
| 出版: |
2017
|
| 主题: | |
| 在线阅读: | http://eprints.usm.my/46933/1/Heat%20Transfer%20And%20Deformation%20Of%20Flexible%20Printed%20Circuit%20Board%20With%20Multi%20Ball%20Grid%20Array%20Packages.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|