Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate

Solder joints serve as both electronic and mechanical connections between components as well as substrates in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. An attractive candidate is Sn-Cu...

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التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Ghani, Fitriah Abdul
التنسيق:	أطروحة
اللغة:	English
منشور في:	2018
الموضوعات:	T Technology (General)
الوصول للمادة أونلاين:	http://eprints.usm.my/47290/1/Effect%20Of%20Zn%20Addition%20On%20Microstructure%2C%20Intermetallic%20Compound%20Formation%20And%20Mechanical%20Properties%20Of%20Sn-0.7cu%20Solder%20On%20Cu%20Substrate.pdf
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id	my-usm-ep.47290
record_format	uketd_dc
spelling	my-usm-ep.472902021-11-17T03:42:13Z Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate 2018-03-01 Ghani, Fitriah Abdul T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials Solder joints serve as both electronic and mechanical connections between components as well as substrates in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. An attractive candidate is Sn-Cu alloy as it is cheaper than Ag-containing solders. However, Sn-0.7Cu has been reported to have lower strength than the other lead-free solders. There is potential to further improve the performance of Sn-0.7Cu and increase solder joint reliability especially for high-powered solder joints. In this study Sn-0.7Cu, Sn-0.7Cu -0.5Zn and Sn-0.7Cu -1.0Zn bulk solder alloys were developed. The addition of Zn potentially refines solder microstructure and results in secondary particles that could strengthen the solder. Alloying of Zn also has been reported to decrease thickness of Cu-Sn IMC layer in Sn-based solder alloys. Characterization of the solder alloys focused on the bulk solder microstructure and IMC evaluation. Melting point of solder was determined using Differential Scanning Calometry (DSC) while elemental composition of solders were analysed using X-ray fluorescence (XRF). Aging was done for 100, 200 and 500 hours at 150 °C and 180 °C. Microstructure of bulk solder and the IMC formed at interface between solder and Cu substrate were observed using SEM equipped with EDX. Addition of Zn slightly decreased the wettability compared to Sn-Pb, but still having good wettability because all the wetting angle are in range of 34°to 38°. Results showed that wettability reduced with increasing amount of Zn but the hardness was increased. The addition of Zn also showed increased shear strength up to 40% higher than that of the Sn-Cu solder alloys. 2018-03 Thesis http://eprints.usm.my/47290/ http://eprints.usm.my/47290/1/Effect%20Of%20Zn%20Addition%20On%20Microstructure%2C%20Intermetallic%20Compound%20Formation%20And%20Mechanical%20Properties%20Of%20Sn-0.7cu%20Solder%20On%20Cu%20Substrate.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology (General) T Technology (General)
spellingShingle	T Technology (General) T Technology (General) Ghani, Fitriah Abdul Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
description	Solder joints serve as both electronic and mechanical connections between components as well as substrates in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. An attractive candidate is Sn-Cu alloy as it is cheaper than Ag-containing solders. However, Sn-0.7Cu has been reported to have lower strength than the other lead-free solders. There is potential to further improve the performance of Sn-0.7Cu and increase solder joint reliability especially for high-powered solder joints. In this study Sn-0.7Cu, Sn-0.7Cu -0.5Zn and Sn-0.7Cu -1.0Zn bulk solder alloys were developed. The addition of Zn potentially refines solder microstructure and results in secondary particles that could strengthen the solder. Alloying of Zn also has been reported to decrease thickness of Cu-Sn IMC layer in Sn-based solder alloys. Characterization of the solder alloys focused on the bulk solder microstructure and IMC evaluation. Melting point of solder was determined using Differential Scanning Calometry (DSC) while elemental composition of solders were analysed using X-ray fluorescence (XRF). Aging was done for 100, 200 and 500 hours at 150 °C and 180 °C. Microstructure of bulk solder and the IMC formed at interface between solder and Cu substrate were observed using SEM equipped with EDX. Addition of Zn slightly decreased the wettability compared to Sn-Pb, but still having good wettability because all the wetting angle are in range of 34°to 38°. Results showed that wettability reduced with increasing amount of Zn but the hardness was increased. The addition of Zn also showed increased shear strength up to 40% higher than that of the Sn-Cu solder alloys.
format	Thesis
qualification_level	Master's degree
author	Ghani, Fitriah Abdul
author_facet	Ghani, Fitriah Abdul
author_sort	Ghani, Fitriah Abdul
title	Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
title_short	Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
title_full	Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
title_fullStr	Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
title_full_unstemmed	Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
title_sort	effect of zn addition on microstructure, intermetallic compound formation and mechanical properties of sn-0.7cu solder on cu substrate
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
publishDate	2018
url	http://eprints.usm.my/47290/1/Effect%20Of%20Zn%20Addition%20On%20Microstructure%2C%20Intermetallic%20Compound%20Formation%20And%20Mechanical%20Properties%20Of%20Sn-0.7cu%20Solder%20On%20Cu%20Substrate.pdf
_version_	1747821759405490176

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate

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