Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
Solder joints serve as both electronic and mechanical connections between components as well as substrates in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. An attractive candidate is Sn-Cu...
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | English |
| منشور في: |
2018
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/47290/1/Effect%20Of%20Zn%20Addition%20On%20Microstructure%2C%20Intermetallic%20Compound%20Formation%20And%20Mechanical%20Properties%20Of%20Sn-0.7cu%20Solder%20On%20Cu%20Substrate.pdf |
| الوسوم: |
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