Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
Solder joints serve as both electronic and mechanical connections between components as well as substrates in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. An attractive candidate is Sn-Cu...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 语言: | English |
| 出版: |
2018
|
| 主题: | |
| 在线阅读: | http://eprints.usm.my/47290/1/Effect%20Of%20Zn%20Addition%20On%20Microstructure%2C%20Intermetallic%20Compound%20Formation%20And%20Mechanical%20Properties%20Of%20Sn-0.7cu%20Solder%20On%20Cu%20Substrate.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|