Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging

This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affect...

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Main Author:	Pang, Shi Shiang
Format:	Thesis
Language:	English
Published:	2020
Subjects:	T Technology
Online Access:	http://eprints.usm.my/47762/1/Thermal%20Impact%20Of%20Thermal%20Interface%20Materials%20And%20Heat%20Spreader%20Co-Planarity%20Of%20The%20Electronic%20Packaging.pdf
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spelling	my-usm-ep.477622021-11-17T03:42:09Z Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging 2020-06-01 Pang, Shi Shiang T Technology This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affects the thermal performance of the flip chip package significantly, especially on the junction-to-case thermal resistance of the package. Numerical studies using ANSYS Icepak were conducted to investigate the thermal impact contributed by the TIM1 material properties and thermal degradation due to heat spreader co-planarity in either concave or convex with deflections up to 0.12 mm. The result indicated that the bond line thickness (BLT) and the thermal conductivity of the TIM1 material affected the thermal performance of the flip chip package. The result also showed that with concave deflection improved up to 44 % while convex deflection degraded up to 80 % of the junction-to-case thermal resistance of the flip chip package. The outcome of the study is to propose design guidelines and recommendations for TIM1 material selection and implementation. Higher thermal conductivity and lower the BLT of TIM1 material shall be selected for better thermal performance of the flip chip package. The findings also recommended the co-planarity tolerance for the heat spreader shall not be greater than 0.07 mm for a 60 mm x 60 mm flip chip package with a heat dissipation of 150 W. 2020-06 Thesis http://eprints.usm.my/47762/ http://eprints.usm.my/47762/1/Thermal%20Impact%20Of%20Thermal%20Interface%20Materials%20And%20Heat%20Spreader%20Co-Planarity%20Of%20The%20Electronic%20Packaging.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Aeroangkasa
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology
spellingShingle	T Technology Pang, Shi Shiang Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
description	This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affects the thermal performance of the flip chip package significantly, especially on the junction-to-case thermal resistance of the package. Numerical studies using ANSYS Icepak were conducted to investigate the thermal impact contributed by the TIM1 material properties and thermal degradation due to heat spreader co-planarity in either concave or convex with deflections up to 0.12 mm. The result indicated that the bond line thickness (BLT) and the thermal conductivity of the TIM1 material affected the thermal performance of the flip chip package. The result also showed that with concave deflection improved up to 44 % while convex deflection degraded up to 80 % of the junction-to-case thermal resistance of the flip chip package. The outcome of the study is to propose design guidelines and recommendations for TIM1 material selection and implementation. Higher thermal conductivity and lower the BLT of TIM1 material shall be selected for better thermal performance of the flip chip package. The findings also recommended the co-planarity tolerance for the heat spreader shall not be greater than 0.07 mm for a 60 mm x 60 mm flip chip package with a heat dissipation of 150 W.
format	Thesis
qualification_level	Master's degree
author	Pang, Shi Shiang
author_facet	Pang, Shi Shiang
author_sort	Pang, Shi Shiang
title	Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
title_short	Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
title_full	Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
title_fullStr	Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
title_full_unstemmed	Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
title_sort	thermal impact of thermal interface materials and heat spreader co-planarity of the electronic packaging
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Aeroangkasa
publishDate	2020
url	http://eprints.usm.my/47762/1/Thermal%20Impact%20Of%20Thermal%20Interface%20Materials%20And%20Heat%20Spreader%20Co-Planarity%20Of%20The%20Electronic%20Packaging.pdf
_version_	1747821826812149760

Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging

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