Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affect...
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| Format: | Thesis |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | http://eprints.usm.my/47762/1/Thermal%20Impact%20Of%20Thermal%20Interface%20Materials%20And%20Heat%20Spreader%20Co-Planarity%20Of%20The%20Electronic%20Packaging.pdf |
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