Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
Due to the inherent toxicity of Pb, environmental regulations have been enforced to eliminate the usage of Pb-based solders in electronic devices. Sn-Ag-Cu alloys is an attractive candidate due to good mechanical properties, good wettability and low melting temperature. However, the reliability of S...
Saved in:
Main Author: | Abu Bakar, Nur Adriana Nazifa |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2019
|
Subjects: | |
Online Access: | http://eprints.usm.my/56163/1/Effect%20Of%20Grain%20Refinement%20Process%20Using%20Equal%20Channel%20Angular%20Pressing%20On%20The%20Properties%20And%20Corrosion%20Behaviour%20Of%20Sn-3.0ag-0.5Cu%20Solder_Nur%20Adriana%20Nazifa%20Abu%20Bakar.pdf |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020) -
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016) -
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016) -
Influence of Alumina and Titanium Dioxide Nanoparticles Reinforcement on Sn-3.0ag-0.5cu and Sn-58bi Solder Alloys
by: Segar Singh, Amares Singh Gill
Published: (2015) -
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
by: Nadhrah, Murad
Published: (2021)